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  • Void Free Surface Thermal Conductive Adhesive 1.3W / mK for Power Modules / IGBT / Computer
  • Void Free Surface Thermal Conductive Adhesive 1.3W / mK for Power Modules / IGBT / Computer
Enlarge Void Free Surface Thermal Conductive Adhesive 1.3W / mK for Power Modules / IGBT / Computer

Void Free Surface Thermal Conductive Adhesive 1.3W / mK for Power Modules / IGBT / Computer 

Place of Origin: Guangdong, China (Mainland) 
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Product Detail

Model No.: AIA-1


Void Free Surface Thermal Conductive Adhesive 1.3W / mK for Power Modules / IGBT / Computer


Void Free Surface Thermal Conductive Adhesive 1.3W / mK for Power Modules / IGBT / Computer

 

 

TIS™580-13 Series is dealcoholized, 1 component, room temperature cure thermally conductive silicone adhesive. It possesses good heat conduction and adhesion towards electronic components. It can be cured to a higher hardness elastomer, leads to firmly attached to substrates resulting lower down thermal impedance. Thus, heat transfer among heat source, heat-sink, motherboard, metal casing will become effective. TIS™580-13 Series possesses high thermal conductivity, excellent electrical insulation and is ready-to-use. TIS™580-13 Series has excellent adhesion to copper, aluminium, stainless-steel, etc. As this is a dealcoholized system, it will not corrode, especially, metal surfaces.

 

 

Feature

 

>  Good thermal conductivity: 1.3W/mK

>  Good maneuverability and good adhesion

>  Low shrinkage

>  Low viscosity, leads to void-free surface

>  Good solvent resistance, water resistance

>  Longer working life

>  Excellent thermal shock resistance
  

Application
 
It mainly used in substituting thermally-conductive paste and pads, which currently finds in gap-filling adhesives or heat conduction between LED aluminium motherboard and heat sink, high power electrical module and heat sink. Traditional methods such as fins and screws fixing can be replaced by applying TIS580-13, resulting a more reliable gap-filling thermal conduction, simplified handling and more cost-effective.
E.g. Massive application in integrated circuits in portable computer, microprocessor, high power LED, internal storage module, cache, integrated circuits, DC/AC translator, IGBT and other power modules, encapsulation of semi-conductors, relay switches, rectifiers and transfomers
 

 

Typical values of TISTM580-13
Appearance White paste Test Method
Density(g/cm3,25) 1.3 ASTM D297
Tack-free time(min,25) ≤20 *****
Cure type(1-component) Dealcoholized *****
Viscosity@25 Brookfield (Uncured) 20K cps ASTM D1084
Total cure time(d, 25) 3-7 *****
Elongation(%) ≥150 ASTM D412
Hardness(Shore  A) 25 ASTM D2240
Lap Shear Strength(MPa) ≥2.0 ASTM D1876
Peel Strength(N/mm) 3.5 ASTM D1876
Operation temperature() -60250 *****
Volume Resistivity(Ω·cm) 2.0×1016 ASTM D257
Dielectric Strength(KV/mm) 21 ASTM D149
Dielectric Constant (1.2MHz) 2.9 ASTM D150
Thermal Conductivity W/(m·K) 1.3 ASTM D5470
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Company Info

Dongguan Ziitek Electronic Materials & Technology Ltd. [China (Mainland)]


Business Type:Manufacturer
City: Dongguan
Province/State: Guangdong
Country/Region: China (Mainland)

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