Gold Index: 5558
Dongguan Ziitek Electronic Materials & Technology Ltd. [China (Mainland)]
Business Type:Manufacturer City: Dongguan Province/State: Guangdong Country/Region: China (Mainland)
-50 - 200 Non Toxic Thermally Conductive Interface Silicone Gap Filler Ultra Soft
AIA-1
2015-11-21
Light Gray Adhesive Interface Thermal Conductive Pad For Heatsink Cooling Varies Thickness
Adhesive Interface Thermal Conductive Pad For Heatsink Cooling Varies Thickness &n
Ultra Soft Low Thermal Conductivity Materials PAD Light Green 5.5 MHz Dielectric Constant
Void Free Surface Thermal Conductive Adhesive 1.3W / mK for Power Modules / IGBT / Computer
Ultra Thin Pyrolytic Thermal Graphite Sheet Materials for Laptop / Notebook / LCD TV
Ultra Thin Pyrolytic Thermal Graphite Sheet Materials for Laptop / Notebook / L
Led Lamps Black Thermal Conductive Plastic Housing 5 W / mK with 1.45g / cm Specific Gravity
Led Lamps Black Thermal Conductive Plastic Housing 5 W / mK with 1.45g / cm Spe
Low Melting Point Thermal Phase Changing Materials 5 W / mK with 2.6g / cc Density
Low Melting Point Thermal Phase Changing Materials 5 W / mK with 2.6g / cc Density <strong
Glass Fiber Backing Thermal Adhesive Tape Easy To Stamping Processing For LED Mount Heat Sink
Glass Fiber Backing Thermal Adhesive Tape Easy To Stamping Processing For LED Mount Heat Sink  
Thermal Silicone Foam Rubber Gap Filler for Cooling Components / LED TV Yellow Soft Compressible
Thermal Silicone Foam Rubber Gap Filler for Cooling Components / LED TV Yellow Soft Compressible &
2.5 W / mK Phase Changing Materials For Cache Chips High Thermal Conductive
2.5 W / mK Phase Changing Materials For IGBTs Cache Chips High Thermal Conductive
LED Heat Sinking Thermal Conductive Plastic 2.5W / mK Electric Insulation
IGBTs Phase Change Material Heat Sink 0.024-in / W With Low Thermal Resistance
IGBTs Phase Change Material Heat Sink 0.024-in² / W With Low Thermal Resistance <p
CPU Gray Phase Changing High Thermal Conductivity Materials 2.5w No Heat Sink Preheating
CPU Gray Phase Changing High Thermal Conductivity Materials 2.5w No Heat Sink Preheating <
Blue Soft Thermal Gap Filler 1.5w / Mk For Automotive Engine Control Units UL RoHs
Blue Soft Thermal Gap Filler 1.5w / Mk For Automotive Engine Control Units UL RoHs <strong
High Transmittance Low Temperature Conductive Adhesive Glue 0.3W / mK
High Transmittance Low Temperature Conductive Adhesive Glue 0.3W / mK TIS™ 2
4.5W / mK Heat Cured High Temperature Epoxy Adhesive Water Resistance 0.7 l / g - K Heat Capacity
4.5W / mK Heat Cured High Temperature Epoxy Adhesive Wat