Low Melting Point Thermal Phase Changing Materials 5 W / mK with 2.6g / cc Density AIA-1 manufacturer from China Dongguan Ziitek Electronic Materials & Technology Ltd.

Low Melting Point Thermal Phase Changing Materials 5 W / mK with 2.6g / cc Density

Place of Origin:

Guangdong, China (Mainland)


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Product Detail

Model No.: AIA-1

Low Melting Point Thermal Phase Changing Materials 5 W / mK with 2.6g / cc Density

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Low Melting Point Thermal Phase Changing Materials 5 W / mK with 2.6g / cc Density

TIC™800G series is low melting point thermal interface material. At 50, TIC™800G series begins to soften and flow, filling the microscopic irregularities of both the thermal solution and the integrated circuit package surface, thereby reducing thermal resistance.TIC™800G series is a flexible solid at room temperature and freestanding without reinforcing components that reduce thermal performance.

TIC™800G Series shows no thermal performance degradation after 1,000 hours@130,or after 500 cycles, from -25 to 125.The material softens and does not fully change state resulting in minimal migration (pump out)at operating temperatures.

Applications Include:

> High Frequency Microprocessors
> Notebook and Desktop PCs
> Computer Serves
> Memory Modules
> Cache Chips
> IGBTs

Features:

For Lowest Thermal Resistance :
> 0.014-in² /W thermal resistance
> Naturally tacky at room temperature,
no adhesive required
> No heat sink preheating required

Typical Properties of TIC^TM800G Series
Product Name	TIC^TM805G	TIC^TM808G	TIC^TM810G	TIC^TM812G	Test Method
Color	Gray	Gray	Gray	Gray	Visual
Thickness	0.005" (0.126mm)	0.008" (0.203mm)	0.010" (0.254mm)	0.012" (0.305mm)
Thickness Tolerance	±0.0008'' (±0.019mm)	±0.0008'' (±0.019mm)	±0.0012'' (±0.030mm)	±0.0012'' (±0.030mm)
Density	2.6g/cc				Helium Pycnometer
Temperature range	-25125
Phase Change Softening Temperature	50~60
"Burn In" Temperature	70 for 5 minutes
Thermal Conductivity	5.0 W/mK				ASTM D5470 (modified)
Thermal Impedance @ 50 psi(345 KPa)	0.014-in²/W	0.020-in²/W	0.038-in²/W	0.058-in²/W	ASTM D5470 (modified)
Thermal Impedance @ 50 psi(345 KPa)	0.09-cm²/W	0.13-cm²/W	0.25-cm²/W	0.37-cm²/W	ASTM D5470 (modified)

Standard Thicknesses:

0.005"(0.127mm) 0.008"(0.203mm) 0.010"(0.254mm) 0.0012"(0.305mm)
Consult the factory alternate thickness.

Standard Sizes:

10" x 16"(254mm x 406mm) 16" X 400' (406mm X 121.92M)
TIC™800 series are supplied with a white release paper and a bottom liner. TIC800™ series is available in kiss cut an extended pull tab liner or individual die cut shapes.

Peressure Sensitive Adhesive:

Peressure Sensitive Adhesive is not applicable for TIC™800 series products.

Reinforcement:
No reinforcement is necessary.