Gray -25 - 125 Thermal Interface Material Phase Change for High Power LED Lights

TIC™800G series is  low melting point thermal interface material. At 50, TIC™800G series begins to soften and flow, filling the microscopic irregularities of both the thermal solution and the integrated circuit package surface, thereby reducing thermal resistance.TIC™800G series is a flexible solid at room temperature and freestanding without reinforcing components that reduce thermal performance.

TIC™800G Series shows no thermal performance degradation after 1,000 hours@130,or after 500 cycles, from -25 to 125.The material softens and does not fully change state resulting in minimal migration (pump out)at operating temperatures.
 

Applications Include:

> LED Lighting

> Thermal test stands

> DC/DC Converts

> High Frequency Microprocessors
> Notebook and Desktop PCs
> Computer Serves
> Memory Modules
> Cache Chips
> IGBTs

Features:

For Lowest Thermal Resistance :
> 0.014-in² /W thermal resistance
> Naturally tacky at room temperature,
     no adhesive required             
> No heat sink preheating required

Standard Thicknesses:

0.005"(0.127mm)          0.008"(0.203mm)          0.010"(0.254mm)        0.0012"(0.305mm)                        
Consult the factory alternate thickness.

Standard Sizes:

 10" x 16"(254mm x 406mm)       16" X 400'   (406mm X 121.92M)              
TIC™800 series are supplied with a white release paper and a bottom liner. TIC800™ series is available in kiss cut an extended pull tab liner or individual die cut shapes.
 
Peressure Sensitive Adhesive:

Peressure Sensitive Adhesive is not applicable for TIC™800 series products.

Reinforcement:
No reinforcement is necessary.