Heat Sink Thermal Conductive Acrylic Based Adhesive High Bond Strength 10" x 18" Size

The TIA™800FG Series products are mostly used for bonding heat dissipation fins, microprocessors and other power consumption semiconductors. This type of adhesive tape possesses ultimate bonding strength with low thermal impedance, with which in effect can be able to replace the method of lubricating grease and mechanical fixing.

Features

> Thermal Conductivity: 0.8 W/mK
> High bond strength to a variety of surfaces double sided pressure sensitive adhesive tape
> High performance, thermally conductive acrylic adhesive

Applications

> Mount heat sink onto BGA graphic processor or drive processor
> Mount heat spreader onto power converter PCB or onto motor control PCB
> High performance, thermally conductive acrylic adhesive 
> Can be used instead of heat cure adhesive,screw mounting or clip mounting

Standard Thicknesses:      

 

0.005"(0.127mm)     0.006"(0.152mm)     0.008"(0.203mm)     0.010"(0.254mm)     0.015"(0.381mm)     0.020"(0.508mm)   
Consult the factory alternate thickness.

Standard Sizes: 

10" x 18"(254mm x 457mm)    10" x 400'(254mm x 121.9M) 
Individual die cut shapes can be supplied.

Reinforcement:     

                
TIA™800 Series sheets are fiberglass reinforced.