High Thermal Conductivity Heat Dissipation Thermal Paste for CPU Heatsink Cooling AIA-1 manufacturer from China Dongguan Ziitek Electronic Materials & Technology Ltd.

High Thermal Conductivity Heat Dissipation Thermal Paste for CPU Heatsink Cooling

Place of Origin:

Guangdong, China (Mainland)


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Product Detail

Model No.: AIA-1

High Thermal Conductivity Heat Dissipation Thermal Paste for CPU Heatsink Cooling

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High Thermal Conductivity Heat Dissipation Thermal Paste for CPU Heatsink Cooling

Applications lnclude

> LED lighting

> Semiconductor cases and heat sinks
> Power resistors and chassis, thermostats and mating surfaces, and thermoelectric cooling devices
> CPU's and GPU's
> Automatic dispensing and screen-printing

Typical Properties of TIG™780-30 Series
ProductName	TIG™780-30	Test Method
Color	Gray	Visual
Construction & Compostion	Metal oxide filled silicone oil
Viscosity	1800K cps @.25	Brookfield RVF,#7
Specific Gravity	2.5 g/cm3
Continuous Use Temp	-49 to 392 / -45 to 200	*****
Evaporation	0.15% / 200@24hrs	*****
Thermal Conductivity	3.0 W/mK	ASTM D5470
Thermal lmpedance	0.04-in²/W @ 50 psi(344 KPa)	ASTM D5469

Package:
TIG™780 Series is available in 1kg(pint container),3kg(quart container),and 10kg(gallon container)or custom packaged in syringes for automated applications.